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Diamond grinding paste nanometer 80,000 mesh

原价为:$39.90。当前价格为:$36.90。

Application Scenario **
– ** Semiconductor Manufacturing ** : Silicon wafer, third generation semiconductor (GaN, SiC) substrate polishing, chip packaging surface flattening.
– ** Optical ultra-precision machining ** : laser gyro mirror, infrared lens, optical fiber end face correction of ultra-smooth surface.
– ** Biomedical devices ** : nano-scale antibacterial polishing of artificial joints and surgical tools.
– ** Research grade material preparation ** : Ultimate surface treatment of quantum device substrates, superconducting films, and single crystal diamond substrates.

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Diamond grinding paste 80000 mesh (model W.18) is a cutting-edge product specially developed for ultra-precision polishing at the highest nano level. It is made of the highest single crystal nano diamond particle ** (particle size is about 0.1-0.2 microns) and high stability composite carrier. Through the ultra-high hardness of diamond and the uniform dispersion of nanoscale particles, it breaks through the traditional polishing limit, and can achieve the atomic level flat effect of surface roughness **Ra≤0.001μm**, which is suitable for aerospace, semiconductor chips, ultra-precision optics and other fields that require strict surface integrity

Nanoscale cutting, atomic-scale polishing **
80,000 mesh diamond particles (D100≤0.2μm) accurately remove surface submicron defects with nanoscale cutting depth, combined with a unique “roll-slip” polishing mechanism, significantly reduce subsurface damage, giving the workpiece mirror-like luster and ultra-low roughness.

Dispersion stability technology **
Through the synergistic effect of surface modification process and ionic dispersant, the nano-diamond particles are ensured to be uniformly suspended in the paste for a long time to avoid agglomeration failure, and no secondary dispersion is required to open the lid and reduce the operation threshold.

Intelligent lubrication system **
The composite carrier contains heat transfer enhancement components and self-healing lubrication film, which can quickly generate friction heat (temperature control ≤35 ° C), while dynamically filling micro-grooves, reducing grinding vibration, and protecting the edge integrity of brittle materials (such as silicon, sapphire).

Environmental compatibility **
No heavy metal, no strong acid and alkali addition, in line with RoHS standards, compatible with water/alcohol based cleaning process, suitable for semiconductor industry clean workshop requirements.

Customized service ** : The carrier viscosity and pH value can be adjusted according to customer needs to adapt to the automated production line.
Technical collaboration ** : Provide polishing process parameter optimization scheme free of charge to ensure that the yield is increased by ≥30%.

####  Precautions **
– Do not mix with acid polishing liquid to prevent oxidation failure of nanoparticles.
– After opening, it should be used up within 48 hours, and the unused paste should be sealed and refrigerated with nitrogen (2-8℃).
– Wear ESD gloves to avoid paste contamination.

Diamond grinding paste 80000 mesh with the highest nano precision, industrial reliability ** redefine the boundary of ultra-precision polishing, is the core of high-end manufacturing and cutting-edge technology to break through the process bottleneck. For samples or custom solutions, please contact our technical team!

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